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Mediatek • Singapore
Role & seniority
Stack/tools
DRC/LVS/ANT/ERC/ESD/PERC sign-off tools (Calibre, ICV, Assura, Star-RCXT)
Scripting: Python, TCL, Perl, or C-shell
UNIX/Linux environment
Familiar with IC design front-to-backend flow
3D IC design experience (CoWoS, SoIC, EMIB) is a plus
Top 3 responsibilities
Lead full-chip physical verification sign-off (DRC/LVS/ANT/ERC/ESD/PERC) for tape-out
Collaborate with Place & Route to resolve full-chip layout integration issues; coordinate with IP owners and Manufacturing on DRC issues
Develop automation to improve tape-out flow efficiency; report tapeout PV issues
Must-have skills
Bachelor’s or Master’s in Electrical/Electronic Engineering or Computer Science
Strong problem-solving, analytical, and communication skills
Proficiency in scripting (Python, TCL, Perl, or C-shell) and UNIX/Linux
Familiarity with IC design front-to-backend flow
Experience with PV sign-off tools (Calibre, ICV, Assura, Star-RCXT)
Nice-to-haves
Location & work type
Location: One North, Singapore
Work type: Not specified in description
Job Description
MediaTek Chip Physical Verification team is looking for qualified candidate to be part of a team that define and enable physical sign-off flow and solutions for SOC design. The candidate will be enabling technology in advanced technology nodes.
Responsible for Full-chip Physical Verification Sign-off in area of (DRC, LVS, ANT, ERC, ESD, PERC) for tape-out. Co-work with Place & Route team to resolve full-chip layout integration issues. Coordinates with internal IP owners on IP related issues. Coordinates with Manufacturing Team on DRC related issues. Provide automation solutions to improve efficiency in tape-out flow. Report on tapeout PV issues.
Requirement
Bachelor/master’s degree in electrical/Electronic Engineering/Computer Science Familiar with IC Design front-to-backend flow Preferably well-versed in Calibre, ICV, Assura, Star-RCXT Proficient in script programming, such as Python, TCL, Perl, or C-shell Proficient in UNIX (Linux) platforms Strong communication skills, problem solving and analytical skills. Experience with 3D IC design (e.g., CoWoS, SoIC, EMIB) is a plus.
Location: One North, Singapore