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TE Connectivity • Bangkok, Thailand
Role & seniority: Senior Product Development Engineer, Signal Integrity
Stack/tools: electrical design, high-speed SI; PCB design and layout; SI analysis tools (Agilent ADS, Ansys HFSS, CST or equivalents); basic test equipment familiarity; English communication; cross-functional collaboration (mechanical, manufacturing, operations)
Serve as subject matter expert for signal integrity from analysis through prototype fabrication and production verification
Establish SI performance requirements and perform simulations for multiple high-speed interfaces; derive setup/methodology and criteria
Review PCB schematics/layouts and guide connector design and component qualifications; translate results into actionable design improvements
Bachelor’s degree in Electrical Engineering or equivalent
8+ years in electrical/RF/PCB design with SI focus
Proficiency with SI tools ( ADS, HFSS, CST or equivalents )
Strong understanding of electromagnetic theory and circuit behavior
Analytical ability to interpret simulation/lab data and drive resolutions
PCB design, fabrication, and assembly familiarity
English fluency; ability to work across time zones in a global environment
Interconnect design experience (socket/connector/cable assemblies, high-speed cables)
Experience with high-speed communications systems (servers, switches, routers, antennas, RF front end)
Presentation,
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
As a Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success.
Responsibilities
Job Requirements
Subject matter expert in signal integrity design, simulation and validation activities through product development cycles Establishing signal integrity design performance/functional requirements for new products Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Performing PCB design schematic and layout reviews Creating actionable recommendations based upon design reviews and simulation results Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.
Required Skills/Experience
Bachelor’s degree in Electrical Engineering or equivalent work experience 8+ years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently
What Your Background Should Look Like
Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork