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TE Connectivity • Bangkok, Thailand
Role & seniority: Sr. Product Development Engineer (Signal Integrity) with senior, independent contributor responsibility
Stack/tools: Electrical/RF design and SI analysis; PCB schematic/layout review; SI tools (Agilent ADS, Ansys HFSS, CST or equivalents); familiarity with PCB design/fabrication (Altium); test equipment (scope, VNA, BERT)
Act as subject matter expert for signal integrity across product development, from initial analysis through prototype evaluation and production verification
Perform SI simulations for multiple high-speed interfaces, define methodologies, and derive design/performance requirements; create actionable recommendations from reviews and simulations
Guide connector design and component qualifications from SI perspective; influence product functionality and drive data-driven improvements
BS in Electrical Engineering or equivalent; 5+ years in electrical/RF/PCB design
Proficiency with SI analysis tools (ADS, HFSS, CST or equivalent)
Solid electromagnetics understanding and ability to interpret simulation/lab data
PCB design, fabrication, and assembly familiarity
English fluency; ability to collaborate across global teams and time zones
Experience with interconnect design (sockets/connectors/cables, DAC/twinax) and RF subsystems
Design experience in high-speed communication systems and networks
Strong presentation, organizational, and
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
As a Sr. Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success.
Responsibilities
Job Requirements
Subject matter expert in signal integrity design, simulation and validation activities through product development cycles Establishing signal integrity design performance/functional requirements for new products Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Performing PCB design schematic and layout reviews Creating actionable recommendations based upon design reviews and simulation results Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.
Required Skills/Experience
Bachelor’s degree in Electrical Engineering or equivalent work experience 5+ years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently
What Your Background Should Look Like
Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques
Competencies
SET: Strategy, Execution, Talent (for managers)